Technical data - Signal distribution board

PCB layer stack

Multilayer PCB, min. 4 layers

PCB thickness

1.6 mm ± 10 %

Board connector

Samtec: SSQ-120-01-L-D

Placing of modules

Starting from the left:
Coupler, power supply module, EJ-modules

E-bus power supply

EJ1100 (2.2 A)
EJ1101-0022 + (EJ9400 (2.5 A) or EJ9404 (12 A))

Refresh of E-bus power supply

EJ9400 (2.5 A)
EJ9404 (12 A)

Air gap and leakage distances between E-bus- and field signals

typ. 1.2 mm

Differential impedance of the LVDS traces

100 Ω

SGND connection

via mounting bolts

Mounting hole distances

max. 100 mm

Reaching area

92 mm

Module depth above PCB

min. 55 mm

Distance between PCB and mounting surface

min. 4 mm

Mounting position

Standard

U_EBUS: Power supply E-bus

The power supply U_EBUS is provided by the coupler and supplied from the supply voltage Us of the EtherCAT coupler.

U_EBUS: E-bus power supply 3.3 V

GND: E-bus GND signal;
Notice Don`t connect with 0 V Up and 0 V Us!

Us: Power supply bus side

The power supply Us is used to supply the bus coupler electronics and to generate voltage for the E-bus (U_EBUS).

0 V Us: Bus side GND signal
Notice Don`t connect with GND (E-bus GND signal)!

24 V Us: Bus side power supply 24 V

Up: Power supply field side

The peripheral voltage Up supplies the electronics on the field side.

0 V Up: GND signal field side
Notice Don`t connect with GND (E-bus GND signal)!

24 V Up: Power supply field side 24 V

SGND: Shield Ground

Ground signal with shielding function in relation to the rest of the board

Notice Us, Up and SGND must not be in direct contact with each other! Connect the SGND signal directly to the mounting plate via metal bolts (see chapter SGND Connection)

Notice

Damage to devices possible

Note the specifications and notes for the components used!